Excerpts from Microvolt-zip.doc

"Controlling Conducted & Radiated Emissions by   Design" has gone through significant revisions.

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New  document  is called "  Controlling  complex Conducted  and  Radiated  Emissions and  Cross Talk  issues  with  Innovative  and  Practical  approaches"

Also known as, how to Achieve Electromagnetic Compatibility with Innovative and Practical approaches. . The  emphasis is on a  technique of "Simple Solutions to Complex Problems".-The  shorter  time-to-market  cycles  have  lead to  the  development  of  this  document which ensures system  level electrical  functionality  and  electromagnetic  compatibility  at first (in most cases) / second  prototype  stages only  of  a  product,  rather  than expensive several  revisions.


Now, there is a promotional cost of $99.95 for this document. This price is for the document with live formulas, without live formulas it’s cost is $39.95 only.  This offer is valid for a limited time only. These costs are valid for shipment of this document by email only. The document will be sent right away or within 1-3 working days upon receipt of payments (by check/money order or Paypal etc.,  in US dollars) .



How to order: Please send check/money order/ bank draft in US dollars payable to Microvolt Labs, Inc., For orders from foreign countries  please send payments in US dollars (or send-email to consulting@microvolt.com ).

Address:

Microvolt Labs, Inc.
Buffalo Grove, IL 60089
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This document is a  most comprehensive document you will  ever find out there in the  EMI/EMC area of  specialization. It is full of experimental results gathered over several years in the PC, telecommunication, networking and electrical industries. This document also  provides references to more than  12  books for  further study of materials discussed in this document, one of which also describes about filter softwares available on the market.

“There is PCB space available on all layers under cable header on the PCB at I/O connection.  This capacitor is intended for common mode noise signals filtering at I/O, it may also provide protection against ESD (electrostatic discharge). The embedded capacitor will have one plate common to CGND and other individual plates connect to each trace as shown below in fig. 4a. This arrangement can save you many discrete capacitors!"

"Trace Inductance and Via models:
 Reference book #10 has covered this topic in much more details. I shall present  this topic with  few  examples, which  has  proven the necessity of  understanding  these issues at  early on  stages of  a  product, such  as first prototype. There are several scenarios one must take into account when designing very high frequency circuits. By high frequency I mean fundamental clock frequency (>1MHz), or rise or fall times of the order of few nano seconds or less. However, it is  also possible clock  signals with clock  frequencies much  less than 1MHz, and  rise and fall times in the nano seconds range could have Fourier spectrum extending all the way in  the hundreds of Megahertz range or even higher.

(a) Depending upon frequency or rise/fall times or in other words the desired Band width for the signal to be transmitted from source to receiver, designer has to use micro-strip transmission lines or strip-line transmission lines. Strip lines are useful for relatively low frequency design as compared to micro strip transmission lines. However, one great advantage of using strip line technique provides shielding from one layer to the other as well.

 Examples:
           In  case of  a  50 ohm micro-strip transmission line, a capacitance of 5pf/inch, the  value of  inductance

 will be  Z=    (L/C) 12.5nH/inch.

(b) Trace without an image  plane or  image plane is at  an infinite distance (usually enclosure for common mode noise signal) from it.
 Inductance of a Wire:

 L=5.08 *Len*[ln(4*Len/d)-0.75]
Where, L= inductance in nH, Len= length in inches ....."

Thank you.

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